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Process Support Engineer II

amat · Hiroshima

New
Onsite Mid 🇬🇧 English
Chemical Vapor Deposition Atomic Layer Deposition Plasma Reactive Ion Etch Physical Vapor Deposition Anneal Implant Design of Experiments

Job description

About the role

As a Process Support Engineer II you will guide semiconductor equipment through its full lifecycle, from concept to qualification, providing high‑visibility on‑site support and collaborating with customers and R&D teams to develop cutting‑edge processes.

Key responsibilities

  • Provide on‑site installations, system diagnoses, and service/repair of complex semiconductor equipment.
  • Work with customers to develop advanced processes for manufacturing leading‑edge chips.
  • Create hypothesis experiments and design of experiments (DOE), analyze data statistically, and compile high‑level reports.
  • Troubleshoot complex issues, perform root‑cause analyses, and resolve difficult process engineering problems.
  • Communicate with internal stakeholders and customers to build relationships and achieve goals.

Required profile

  • Bachelor’s degree in chemistry, physics, materials engineering, electrical engineering, optoelectronics or related field.
  • 2–4 years of experience in the semiconductor fab or equipment industry.
  • Proficiency in English communication.

Required skills

  • Chemical Vapor Deposition (CVD)
  • Atomic Layer Deposition (ALD)
  • Plasma Reactive Ion Etch (RIE)
  • Physical Vapor Deposition (PVD)
  • Anneal processes
  • Implant processes
  • Design of Experiments (DOE)
  • Statistical data analysis

Questions fréquentes

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Source : ats:workday

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Published 3 hours ago

Expires 1 month from now

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amat

Hiroshima